Design and fabrication of wearable electronic textiles using twisted fiber-based threads

Kailin Zhang, Xiang Shi, Haibo Jiang, Kaiwen Zeng, Zihao Zhou, Peng Zhai, Lihua Zhang, Huisheng Peng

Published: 2024-03-01 DOI: 10.1038/s41596-024-00956-6

Extended

Extended Data Fig. 1 Stability of interconnections.

a , The resistance change of the interconnections bonded by silver paste or low-temperature solder under different bending angles. b – d , The resistance change of the interconnections under bending at 90° ( b ), 5 N load friction ( c ) and π rad/cm twisting ( d ). Error bars show standard deviations of the results from 10 samples.

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